Reliability Properties of Carbon Nanotube-filled Solderable Anisotropic Conductive Adhesives
نویسندگان
چکیده
منابع مشابه
Solderable Anisotropic Conductive Adhesives for 3d Package Applications
3D packaging has recently become very attractive because it can provide more flexibility in device design and supply chain, reduce the gap between silicon die and organic substrate, help miniaturize devices and meet the demand of high speed, provide more memory, more function and low cost. With the advancement of 3D packaging, the bump height is now down from 80μ to 10μ. When the bump diameter ...
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ژورنال
عنوان ژورنال: Journal of Welding and Joining
سال: 2017
ISSN: 2466-2232
DOI: 10.5781/jwj.2017.35.3.3